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HD74AC174
Hex D-Type Flip-Flop with Master Reset
Description
The HD74AC174 is a high-speed hex D flip-flop. The device is used primarily as a 6-bit edge-triggered storage register. The information on the D inputs is transferred to storage during the Low-to-High clock transition. The device has a Master Reset to simultaneously clear all flip-flops.
Feature
* Outputs Source/Sink 24 mA
Pin Arrangement
MR 1 Q0 2 D0 3 D1 4 Q1 5 D2 6 Q2 7 GND 8 (Top view)
16 VCC 15 Q5 14 D5 13 D4 12 Q4 11 D3 10 Q3 9 CP
HD74AC174
Logic Symbol
D0 D1 D2 CP MR
D3 D4 D5
Q0 Q1 Q2 Q3 Q4 Q5
Pin Names
D0 to D5 CP MR Q0 to Q5 Data Inputs Clock Pulse Input Master Reset Input Outputs
Functional Description
The HD74AC174 consists of six edge-triggered D flip-flops with individual D inputs and Q outputs. The Clock (CP) and Master Reset (MR) are common to all flip-flops. Each D input's state is transferred to the corresponding flip-flops's output following the Low-to-High Clock (CP) transition. A Low input to the Master Reset (MR) will force all outputs Low independent of Clock or Data inputs. The HD74AC174 is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements.
Truth Table
Inputs MR L H H H H: L: X: : L High Voltage Level Low Voltage Level Immaterial Low-to-High Transition of Clock CP X D X H L X Output Q L H L Q
2
HD74AC174
Logic Diagram
MR CP D5 D4 D3 D2 D1 D0
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP CD
CP CD
CP CD
CP CD
CP CD
CP CD
Q5
Q4
Q3
Q2
Q1
Q0
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
DC Characteristics (unless otherwise specified)
Item Maximum quiescent supply current Maximum quiescent supply current Symbol I CC I CC Max 80 8.0 Unit A A Condition VIN = VCC or ground, VCC = 5.5 V, Ta = Worst case VIN = VCC or ground, VCC = 5.5 V, Ta = 25C
AC Characteristics: HD74AC174
Ta = +25C CL = 50 pF Item Maximum clock frequency Propagation delay CP to Qn Propagation delay CP to Qn Propagation delay MR to Q n Note: t PHL t PHL t PLH Symbol f max VCC (V)*1 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 Min 90 100 1.0 1.0 1.0 1.0 1.0 1.0 Typ 100 125 9.0 6.0 8.5 6.0 9.0 7.0 Max -- -- 11.5 8.5 11.0 8.0 11.5 9.0 Ta = -40C to +85C CL = 50 pF Min 70 100 1.0 1.0 1.0 1.0 1.0 1.0 Max -- -- 12.5 9.5 12.0 9.0 12.5 10.5 ns ns ns Unit MHz
1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V
3
HD74AC174
AC Operating Requirements: HD74AC174
Ta = +25C CL = 50 pF Item Setup time, HIGH or LOW Dn to CP Hold time, HIGH or LOW Dn to CP MR pulse width, LOW tw th Symbol t su VCC (V)*1 Typ 3.3 5.0 3.3 5.0 3.3 5.0 CP pulse width tw 3.3 5.0 Recovery time MR to CP Note: t rec 3.3 5.0 2.5 2.0 1.0 0.5 1.0 1.0 1.0 1.0 0 0 Ta = -40C to +85C CL = 50 pF Guaranteed Minimum 6.5 5.0 3.0 3.0 5.5 5.0 5.5 5.0 2.5 2.0 7.0 5.5 3.0 3.0 7.0 5.0 7.0 5.0 2.5 2.0 ns ns ns ns Unit ns
1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V
Capacitance
Item Input capacitance Power dissipation capacitance Symbol CIN CPD Typ 4.5 85.0 Unit pF pF Condition VCC = 5.5 V VCC = 5.0 V
4
19.20 20.00 Max 16 9 7.40 Max 6.30
Unit: mm
1 1.3
1.11 Max
8
0.51 Min
2.54 Min 5.06 Max
7.62
2.54 0.25
0.48 0.10
0.25 - 0.05 0 - 15
Hitachi Code JEDEC EIAJ Weight (reference value)
+ 0.13
DP-16 Conforms Conforms 1.07 g
Unit: mm
10.06 10.5 Max 16 9
5.5
1
*0.22 0.05 0.20 0.04
8 0.80 Max
2.20 Max
0.20 7.80 + 0.30 -
1.15 0 - 8 0.70 0.20
1.27 *0.42 0.08 0.40 0.06
0.12 M
Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DA -- Conforms 0.24 g
*Dimension including the plating thickness Base material dimension
0.10 0.10
0.15
Unit: mm
9.9 10.3 Max 16 9 3.95 1 1.27 0.635 Max 8
0.11 0.14 + 0.04 - 1.75 Max
*0.22 0.03 0.20 0.03
0.10 6.10 + 0.30 -
1.08 0 - 8
0.67 0.60 + 0.20 -
*0.42 0.08 0.40 0.06
0.15 0.25 M
*Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
FP-16DN Conforms Conforms 0.15 g
Unit: mm
5.00 5.30 Max 16 9 4.40 1
0.08 *0.22 + 0.07 -
8 0.65 1.0 6.40 0.20 0 - 8 0.50 0.10
0.20 0.06
0.13 M 0.65 Max
*0.17 0.05 0.15 0.04
1.10 Max
0.10
0.07 +0.03 -0.04
*Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
TTP-16DA -- -- 0.05 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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